The Effect of Aging Time and Sb Addition on Growth Behavior of Interfacial Intermetallic Compounds at Sn-9Zn-3Bi/Cu Solders Joints Interface
TU Wenbin1,*, HU Zhihua2, ZOU Yurou1, LIU Guanpeng1, WANG Shanlin1, CHEN Yuhua1
1 Jiangxi Key Laboratory of Forming and Joining Technology for Aerospace Components, Nanchang Hangkong University, Nanchang 330063, China 2 Jiangxi General Institute of Testing and Certification, Nanchang 330052, China
Abstract: The intermetallic compounds(IMC) at the interface of lead-free solder joints play a key role in affecting the reliability of the solder joints. In this work, the effects of aging time and Sb addition on the morphology of IMC and corresponding growth kinetics of the Sn-9Zn-3Bi/Cu solder joint were studied by scanning electronic microscope (SEM). The results show that the thickness of the interfacial IMC at the Sn-9Zn-3Bi/Cu solder joint increase as the aging time increase, and the type of IMC was γ-Cu5Zn8 phase. After long period of aging, the addition of Sb reduced the thickness of the interface IMC at the Sn-9Zn-3Bi/Cu solder joint, and the growth coefficient of the IMC decreases from 0.67 μm/h1/2 to 0.56 μm/h1/2. As the aging time increases to 168 h, except for the existence of the interfacial γ-Cu5Zn8 phase, the Cu6Sn5 phase is formed near Cu substrate, and the diffusion interaction layer is formed near solder matrix too. The Sb element will diffuse into the Cu6Sn5 phase and exist in the form of solid solution.
涂文斌, 胡志华, 邹雨柔, 刘冠鹏, 王善林, 陈玉华. 时效时间和Sb添加对Sn-9Zn-3Bi/Cu焊点界面金属间化合物生长行为的影响[J]. 材料导报, 2025, 39(6): 23120193-6.
TU Wenbin, HU Zhihua, ZOU Yurou, LIU Guanpeng, WANG Shanlin, CHEN Yuhua. The Effect of Aging Time and Sb Addition on Growth Behavior of Interfacial Intermetallic Compounds at Sn-9Zn-3Bi/Cu Solders Joints Interface. Materials Reports, 2025, 39(6): 23120193-6.
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2025, Vol. 39 
